Dual-socket virtualization servers
Virtualization, enterprise servers, application and data services, compute-intensive applications

Application Field

The server is suitable for desktop virtualization in multiple fields and is widely used in scenarios such as centralized office of medium and large enterprises, campus cloud classrooms, government offices, and financial and medical care. In enterprise scenarios, it can realize unified management and control of thousands of virtual desktops, help reduce costs, increase efficiency and ensure data security; In the campus scenario, it can meet the needs of large-scale terminal access in the computer room and support the unified distribution of teaching resources. the government field can adapt to terminal virtualization transformation to achieve centralized data control, meet security specifications and improve office efficiency; For scenarios with high security and stability requirements, such as finance and healthcare, data leakage is prevented through centralized management to ensure smooth business operation.

Product Features

Dual-socket Type E (LGA-4677) 5th/4th Gen Intel Xeon ® Scalable processors ®

processor, supporting TDP up to 300W;

16 DIMM slots supporting up to 4TBDDR5-5600MHz/4800MHz ECC registered RDIMM; 4 PCIe5.0x16 Low Profile (LP) interfaces, 1 PCIe 5.0x8 Low Profile (LP) ports, 16 hot-swappable 2.5-inch hard drive bays, support for 8 SASRAID (0, 1, 5, 6, 10,

50, 60) and 8 SATA hard drives;

1200W redundant titanium level power supply;


Technical Specifications

Name 主流超级服务器
Model SDY-221P-C9R
Specification 2U机架式服务器
Size 437 x 89 x 630毫米(17.2英寸 x 3.5英寸 x 24.8英寸)
Power Support 2个1200W冗余(1+1)钛电平(96%)热插拔电源
Hard Disk Support 默认值:总计16个舱位 4个前置热插拔2.5英寸NVMe/SAS/SATA硬盘位 4个前置热插拔2.5英寸SAS/SATA硬盘位 8个2.5英寸SAS/SATA热插拔硬盘位 (支持NVMe/SAS接口可能需要额外的存储控制器和/或线缆) M.2:2个M.2 NVMe插槽(M-key) 外置存储槽:1个精简DVD卡槽(可选)
Expansion Card Slot 4个PCIe 5.0 x16低功耗插槽 1个PCIe 5.0 x8 LP插槽
Back Panel 最高支持4TB 5600MT/s ECC DDR5 RDIMM
CPU Support Type 双插槽E型插槽(LGA-4677),第五代英特尔®至强®处理器/第四代英特尔®至强®可扩展处理器
Number Of Memory Slots 插槽数量:16个DIMM插槽;最大内存容量(1DPC)
Operating Temperature 工作温度:10°C至35°C(50°F至95°F)工作相对湿度:8%至80%(非冷凝型)
Storage Temperature And Humidity 非工作温度范围:-30°C至60°C(-40°F至140°F)非工作状态相对湿度:8%至90%(非冷凝)
Chipset Intel® C741
Network Interface 2个RJ45 1GbE接口