On August 8, 2019, AMD released the second-generation EPYC Opteron processor in the 7nm process, which is the data center processor codenamed Rome Rome, up to 64 cores and 128 threads. This day is destined to be AMD's highlight moment. Write history. Shenzhen Sanduoyun Industrial Technology Co., Ltd...
View
AMD's second-generation EPYC processor not only uses the advanced 7nm production process, but also based on the new Zen 2 architecture, and its core specifications up to 64 cores and 128 threads, supports 128 PCIe 4.0 channels, and provides very reliable security from the hardware level. Sex. From o...
View
Intel recently announced that the next-generation Xeon Scalable (Xeon Scalable) processor family (codenamed Cooper Lake) will implement a single interface with up to 56 cores. Cooper Lake Xeon's x86 is the first to introduce standardized AI acceleration training features, supporting bfloat16, and is...
View
The second-generation EPYC processor is enhanced with the advanced AMD EPYC Infinity architecture. In terms of other functions, the second-generation AMD EPYC processor highlights multi-domain applications, including big data analysis, in-memory databases, data center applications, etc. in the Inter...
View
Virtualization and software-defined infrastructure are critical to increasing data center productivity and enabling IT automation. The AMD EPYC processor's powerful dual-socket server and innovative, uncompromising, single-socket server are ideal for virtualized IT environments. The AMD EPYC solutio...
View
The AMD EPYCTM processor features a balanced architecture with superior computing power, memory, I/O, and security to easily accelerate your mission-critical applications. Guangzhou Tianhao Information Technology Co., Ltd....
View
AMD EYPC Snapdragon is now facing increasing challenges in the face of engineering, research and scientific innovators. With the extension of high-performance computing (HPC) definitions, further integration with big data analytics, machine learning, and artificial intelligence (AI), people need a m...
View
Current wafers are made from silicon. It is known that the diameter of silicon atoms is about 0.22 nm. Considering the distance between atoms, the theoretical limit is at least 0.5 nm, but certainly no company can do it. It is generally believed that 3nm will be the limit of the chip process technol...
View
Recently, the Wi-Fi Alliance for the development of wireless technology standards, the SDA Association for the development of SD memory card standards, the Bluetooth Alliance, and the JEDEC (Solid State Technology Association) all removed Huawei from the membership list. However, the incident was su...
View